Haze Removal System
RAVE is once again pioneering another breakthrough in advanced equipment technology with the introduction of the new Rhazer™ Haze Removal System.
Haze contamination on photomasks has become a pervasive and costly problem throughout the Semiconductor Industry. Recent wet clean and environmental control techniques have helped to slow haze formation during wafer stepper exposures, but show no promise of a haze prevention solution.
The Rhazer™ system does not prevent haze, but allows the wafer fab to “manage” it! The Rhazer™ system is designed to reside in the wafer fab and provide a resident capability to reduce haze growth below printable levels from both sides of reticles in less than one working shift. The process is dry and does not require removal of the pellicle. Although haze is expected to reform, the Rhazer™ process causes no damage to the mask absorber materials, meaning reticles can be cleaned as often as needed without leaving the control of the fab line.
The Rhazer™ system can be used to:
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Preventive Maintenance Cleans – During wafer production, masks that begin to show haze are processed in-fab and then quickly returned to the lithography line.
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Post-Cleans – Masks are processed immediately following lithography line use and just before transfer to the reticle stocker to neutralize haze formation during long term storage.
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Re-Cleans – Masks retrieved from storage for device design re-orders are processed to avoid wet clean, time consuming re-qualification procedures and to ensure no unexpected haze growth during the production.
Contact RAVE today at sales@ravenano.com to
arrange a Rhazer™ haze removal demonstration.
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