nm450 - The new global standard in advanced production mask repair.
Over the past 7 years, RAVE nanomaching has become the preferred production technique for precision repair of advanced, critical level Photomasks. The new nm450 system is RAVE’s fourth generation of AFM Guided Nanomachining technology. The nm450 sets RAVE apart as the company that can develop and deliver the innovative nano-scale material shaping processes required to keep the Semiconductor Industry in concert with Moore’s Law through the 45 nanometer technology node and beyond.

• Production 45nm technology node mask repair for all mask types with accuracy and precision suitable for 32nm technology node mask development.
  
  
• Repair process is defined by final geometry, independent of material composition, material interfaces or geometry being removed.
  
  
• Extraordinary depth (Z) control to target permits repairs to be specifically matched to the specified reference or differentially biased at or below the substrate surface for exact phase matching.
  
  
• Iterative repair capability and planar material removal guarantees a much wider "Through Focus" transmission window.
  
  
• Production proven AFM guided nanomachining with no vacuum requirement, no chemistries, no chemical residues, no beam related charging effects, no need for constant drift correction by re-registration to undesirable positioning markers.
  
  
• Fully automated, SMIF compatible, highly user friendly GUI software and process control programs for ease of use and speed of repair operations.

::nm450 - Critical Performance Specifications

• Nanomachinable Materials: Chrome, MoSi, Quartz, EUV, Foreign Materials.
  
  
• Transmission: 100% ±3% (Repaired area as referenced to Non-repaired area).
  
  
• Depth (Z) Control: 3 nm (3Σ from Target) All Materials
  
  
• Edge Placement: 5 nm (3Σ from Target) All Materials